3D Laserscanning
Reality as the basis for all engineering.
Successful engineering begins with reliable data.
With our Leica RTC360, we capture existing installations, buildings, and industrial environments with millimeter accuracy in a digital 3D point cloud. This provides you with a complete and reliable digital image of the existing situation before engineering begins.
No inaccurate measurements. No missing information. No surprises during execution.
Why choose 3D laser scanning?
Traditional surveys are often time-consuming and provide only a limited picture of reality.
With 3D laser scanning, millions of measurement points are captured within minutes. This results in a highly accurate digital representation that can be used for engineering, BIM, reverse engineering, inspections, and project preparation.
The benefits
✔ Millimeter-accurate measurements
✔ Fast measurements with minimal production downtime
✔ Complete digital documentation of existing installations
✔ Lower failure costs during engineering and execution
✔ Ideal basis for BIM and reverse engineering
✔ Safe measurements, even in hard-to-reach locations
From scan to engineering
A point cloud is only valuable when it is converted into usable engineering.
R-Tech Design manages the entire process: from 3D laser scanning and point cloud processing to BIM models, 3D CAD models, reverse engineering, and technical project support.
This way, you have one reliable partner for the entire Scan-to-Design process.
Applications
- Brownfield projects
- Mechanical engineering
- Industrial installations
- Production lines
- Factory expansions
- As-built documentation
- Reverse engineering
- BIM modeling
- Technical renovations
- Projectconsultancy
Why R-Tech Design?
We combine advanced 3D laser scanning with practical experience in industrial engineering.
As a result, we not only provide accurate measurement data, but also actively contribute ideas regarding the technical design, project planning, and feasibility of your project.
Reality captured. Engineering delivered.
